Semicap
Wafer fab, process control, test, and advanced packaging equipment used to build AI silicon.
Mapped companies
61
Segments
0
Largest
ASML.AS
Stack layer
Manufacturing
Segment
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Company Universe
Semicap names above $1B
61 shown, sorted by approximate USD market cap
ASML.AS
ASML Holding N.V.
Critical EUV and DUV lithography choke point for AI accelerator and HBM capacity.
Market cap
$568.4B
LRCX
Lam Research Corporation
Core process-equipment supplier to AI compute and HBM manufacturing ramps.
Market cap
$334.4B
AMAT
Applied Materials, Inc.
Broad process-equipment exposure to AI logic, memory, and advanced packaging capex.
Market cap
$331.0B
KLAC
KLA Corporation
Yield-control layer for leading-edge AI chips, HBM, and advanced packaging.
Market cap
$254.2B
6857.T
Advantest Corporation
Key test-equipment supplier for AI accelerators, HBM, and advanced packages.
Market cap
$134.1B
8035.T
Tokyo Electron Limited
Broad front-end process-equipment exposure to AI logic and memory fabs.
Market cap
$131.9B
TER
Teradyne, Inc.
Test-equipment exposure to AI accelerators, networking silicon, and memory.
Market cap
$65.5B
002371.SZ
NAURA Technology Group Co., Ltd.
China domestic wafer-fab equipment exposure for AI-related logic and memory capacity.
Market cap
$50.1B
ASM.AS
ASM International N.V.
Deposition process control for leading-edge logic and memory nodes used in AI hardware.
Market cap
$49.7B
6146.T
Disco Corporation
Enables thin wafers, chiplets, HBM, and advanced package preparation.
Market cap
$48.8B
688012.SS
Advanced Micro-Fabrication Equipment Inc. China
Domestic China etch and deposition equipment exposure tied to advanced AI semiconductor capacity.
Market cap
$29.6B
6920.T
Lasertec Corporation
Critical inspection layer for EUV lithography and leading-edge AI chip production.
Market cap
$25.3B
BESI.AS
BE Semiconductor Industries N.V.
Direct advanced-packaging equipment exposure for chiplets, HBM, and AI accelerators.
Market cap
$23.3B
VACN.SW
VAT Group AG
Critical vacuum subsystem exposure to deposition, etch, and other AI fab equipment.
Market cap
$22.3B
7751.T
Canon Inc.
Alternative lithography equipment exposure for semiconductor manufacturing capacity.
Market cap
$21.9B
042700.KS
HANMI Semiconductor Co., Ltd.
Direct HBM and advanced-packaging equipment exposure for AI memory.
Market cap
$19.0B
MKSI
MKS Inc.
Semicap subsystem exposure across deposition, etch, lithography, and packaging tools.
Market cap
$18.9B
NVMI
Nova Ltd.
Metrology control for advanced nodes, memory, and AI package manufacturing.
Market cap
$17.3B
NDSN
Nordson Corporation
Advanced packaging, dispensing, and inspection exposure for AI hardware manufacturing.
Market cap
$15.8B
ONTO
Onto Innovation Inc.
Yield and metrology exposure to advanced packaging, compound semiconductors, and AI devices.
Market cap
$15.3B
6361.T
Ebara Corporation
CMP and vacuum equipment exposure for advanced logic, memory, and packaging capacity.
Market cap
$15.2B
6223.TWO
MPI Corporation
Wafer-level test infrastructure for AI accelerators, HBM, and advanced packages.
Market cap
$14.5B
TPRO.MI
Technoprobe S.p.A.
Wafer-level test exposure for AI processors, chiplets, and high-bandwidth memory.
Market cap
$13.4B
7735.T
SCREEN Holdings Co., Ltd.
Process-equipment exposure to leading-edge logic, memory, and advanced packaging.
Market cap
$12.6B
FORM
FormFactor, Inc.
Wafer-level test exposure for AI processors, memory, and advanced packages.
Market cap
$12.1B
CAMT
Camtek Ltd.
Advanced-packaging inspection beneficiary for HBM, chiplets, and AI accelerators.
Market cap
$9.3B
0522.HK
ASMPT Limited
Advanced-packaging and assembly equipment exposure for AI hardware supply chains.
Market cap
$8.8B
MYCR.ST
Mycronic AB (publ)
Mask-writing and high-precision production equipment exposure to semiconductor manufacturing.
Market cap
$6.4B
AIXA.DE
Aixtron Se
Equipment exposure to power, photonics, and specialty semiconductor infrastructure around AI systems.
Market cap
$6.2B
6856.T
HORIBA, Ltd.
Process control and metrology exposure to advanced semiconductor manufacturing.
Market cap
$5.7B
688037.SS
KINGSEMI Co., Ltd.
China wafer-process equipment exposure for domestic AI semiconductor capacity.
Market cap
$5.3B
KLIC
Kulicke and Soffa Industries, Inc.
Packaging equipment exposure for AI accelerators, memory, and heterogeneous integration.
Market cap
$4.6B
ACLS
Axcelis Technologies, Inc.
Implant equipment exposure to logic, power, and memory capacity supporting AI infrastructure.
Market cap
$4.4B
6323.T
Rorze Corporation
Wafer automation exposure to high-volume AI logic and memory manufacturing.
Market cap
$4.0B
036930.KQ
JUSUNG ENGINEERING Co., Ltd.
Korean deposition equipment exposure to advanced memory and logic manufacturing.
Market cap
$3.8B
240810.KQ
Wonik Ips Co., Ltd
Korean wafer equipment exposure to memory and logic capacity supporting AI infrastructure.
Market cap
$3.8B
6510.TWO
Chunghwa Precision Test Tech. Co., Ltd.
Test-interface exposure for advanced SoCs and AI semiconductor validation.
Market cap
$3.8B
UCTT
Ultra Clean Holdings, Inc.
Semicap subsystem and tool-services exposure to AI fab capacity growth.
Market cap
$3.8B
ACMR
ACM Research, Inc.
Process and packaging equipment exposure to AI semiconductor capacity expansion.
Market cap
$3.7B
7731.T
Nikon Corporation
Lithography and inspection exposure for semiconductor process capacity.
Market cap
$3.5B
VECO
Veeco Instruments Inc.
Specialty process-equipment exposure for advanced logic, photonics, and AI-related devices.
Market cap
$3.1B
6871.T
Micronics Japan Co., Ltd.
Wafer probe and test exposure for memory and logic devices used in AI systems.
Market cap
$3.0B
COTN.SW
Comet Holding AG
Critical RF and inspection subsystem exposure to plasma process tools for AI chip production.
Market cap
$3.0B
AEHR
Aehr Test Systems
Reliability test exposure for advanced semiconductor devices used in AI and power infrastructure.
Market cap
$3.0B
403870.KQ
HPSP Co., Ltd.
Specialty annealing equipment exposure to advanced logic and memory process flows.
Market cap
$2.9B
2467.TW
C Sun Mfg Ltd.
Packaging and substrate process-equipment exposure around AI hardware assembly.
Market cap
$2.6B
ICHR
Ichor Holdings, Ltd.
Semicap subsystem exposure to process tools used in AI logic and memory fabs.
Market cap
$2.5B
COHU
Cohu, Inc.
Back-end test and inspection exposure to AI device production.
Market cap
$2.2B
OXIG.L
Oxford Instruments plc
Specialty etch, deposition, and metrology exposure for photonics and advanced semiconductor development.
Market cap
$2.1B
3583.TW
Scientech Corporation
Wafer handling and process automation exposure to Taiwan semiconductor capacity.
Market cap
$2.1B
6951.T
JEOL Ltd.
E-beam lithography and metrology exposure for advanced semiconductor process development.
Market cap
$2.1B
6590.T
Shibaura Mechatronics Corporation
Front-end and advanced-packaging equipment exposure to AI semiconductor manufacturing.
Market cap
$2.0B
084370.KQ
Eugene Technology Co.,Ltd.
Memory and logic deposition equipment exposure supporting AI semiconductor capacity.
Market cap
$2.0B
098460.KQ
Koh Young Technology Inc.
Inspection exposure to advanced packaging and high-reliability AI hardware assembly.
Market cap
$1.9B
319660.KQ
PSK Inc.
Process-equipment exposure to memory and logic fabs serving AI demand.
Market cap
$1.8B
SMHN.DE
SUSS MicroTec SE
Advanced-packaging and lithography equipment exposure for chiplets and AI devices.
Market cap
$1.6B
089030.KQ
Techwing, Inc.
Back-end test handler exposure for memory and AI device production.
Market cap
$1.5B
AWX.SI
AEM Holdings Ltd.
Back-end and system-level test exposure for AI and high-performance computing devices.
Market cap
$1.5B
6640.TWO
Gallant Micro. Machining Co., Ltd.
Semicap automation and equipment exposure to Taiwan semiconductor manufacturing.
Market cap
$1.4B
140860.KQ
Park Systems Corp.
Advanced process and packaging metrology exposure for leading-edge semiconductor manufacturing.
Market cap
$1.3B
6315.T
TOWA Corporation
Advanced-packaging equipment exposure for high-density AI modules and memory packages.
Market cap
$1.2B