Fabless65Foundry17Memory22Networking57Optics39Semicap61Materials80Integration70DC Infra84AI Cloud26AI Model22
/
Semicap
dashboard
SemicapIndustry / 6315.T
TOWA Corporation
Molding and singulation equipment supplier for semiconductor packaging.
Price
$2599.00
Change
+3.00 (+0.12%)
Market cap
$195.0B
52w range
$1301–$3205
Exchange
JPX
Country
JP
AI relevance
Advanced-packaging equipment exposure for high-density AI modules and memory packages.
Financials
Revenue, margins, cash flow
FY 2024 · reported 2025-03-31
- Revenue
- $53.48B
- Gross margin
- 37.2%
- Op margin (TTM)
- 11.8%
- Net margin (TTM)
- 10.9%
- R&D
- $1.39B
- Free cash flow
- $5.33B
- Capex
- $5.04B
- EV / EBITDA
- 20.0x
Transcripts
Earnings call library
No transcripts on file.
Ownership
13F holders and ETF exposure
No 13F data on file.
Events
Calendar, news, filings
Next earnings
2026-05-11EPS est $90.90