Integration
Board, module, rack, EMS, ODM, and packaging integration suppliers that assemble AI infrastructure.
Mapped companies
70
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Manufacturing
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Company Universe
Integration names above $1B
70 shown, sorted by approximate USD market cap
DELL
Dell Technologies Inc.
Integrates GPU servers, storage, networking, and rack systems for enterprise and cloud AI deployments.
Market cap
$145.8B
2317.TW
Hon Hai Precision Industry Co., Ltd.
Major AI server, rack, enclosure, and systems manufacturing partner for hyperscale AI infrastructure.
Market cap
$98.3B
PWR
Quanta Services, Inc.
Grid and power-delivery buildout exposure driven by AI data center electricity demand.
Market cap
$93.5B
3711.TW
ASE Technology Holding Co., Ltd.
Core OSAT and advanced packaging capacity for high-performance logic, SiP, and heterogeneous AI hardware.
Market cap
$69.0B
FIX
Comfort Systems USA, Inc.
Installer and integrator of cooling, mechanical, and electrical systems for AI data centers.
Market cap
$60.6B
CLS
Celestica Inc.
Manufactures and integrates hyperscale data center networking and AI infrastructure hardware.
Market cap
$47.2B
300476.SZ
Victory Giant Technology (HuiZhou) Co., Ltd.
Supplies high-layer PCB and board capacity for AI servers and high-speed infrastructure systems.
Market cap
$40.3B
2382.TW
Quanta Computer Inc.
Key AI server and rack manufacturing partner for hyperscale and cloud infrastructure deployments.
Market cap
$39.6B
3037.TW
Unimicron Technology Corp.
ABF substrate and high-density board supplier for AI accelerators, advanced packages, and servers.
Market cap
$39.6B
EME
EMCOR Group, Inc.
Electrical and mechanical contractor for AI data center construction and fit-out.
Market cap
$38.9B
009150.KS
Samsung Electro-Mechanics Co., Ltd.
FC-BGA and package substrate capacity supports high-performance processors and AI accelerators.
Market cap
$38.8B
2345.TW
Accton Technology Corporation
Key hyperscale switch and network appliance manufacturing layer for AI data center Ethernet buildouts.
Market cap
$38.0B
HPE
Hewlett Packard Enterprise Company
Public parent for Juniper and Aruba switching, routing, wireless, and AI-driven network operations.
Market cap
$37.4B
JBL
Jabil Inc.
EMS partner for complex compute, networking, storage, and infrastructure hardware programs.
Market cap
$36.1B
FLEX
Flex Ltd.
Builds and integrates complex electronics, data center hardware, and infrastructure systems for OEMs.
Market cap
$33.8B
002916.SZ
Shennan Circuit Company Limited
High-speed PCB and substrate supplier for servers, communications equipment, and AI infrastructure.
Market cap
$30.0B
MTZ
MasTec, Inc.
Power-delivery and infrastructure contractor exposed to data center electrification.
Market cap
$29.7B
002463.SZ
Wus Printed Circuit (Kunshan) Co., Ltd.
High-speed PCB exposure to AI servers, switches, and data center infrastructure hardware.
Market cap
$28.8B
6669.TW
Wiwynn Corporation
Designs and integrates AI servers, rack-scale compute, and storage platforms for hyperscale customers.
Market cap
$27.4B
FN
Fabrinet
Manufacturing scale layer for optical modules and components used in AI data center networking.
Market cap
$25.8B
2368.TW
Gold Circuit Electronics Ltd.
Supplier of high-layer server and networking PCBs for AI data center hardware.
Market cap
$22.1B
4062.T
Ibiden Co., Ltd.
Advanced package substrate supplier for high-performance CPUs, GPUs, and AI accelerators.
Market cap
$22.0B
603019.SS
Dawning Information Industry Co., Ltd.
Builds integrated HPC, AI server, storage, and cluster infrastructure systems.
Market cap
$19.8B
5274.TWO
ASPEED Technology Inc.
Server management control silicon for AI infrastructure.
Market cap
$19.7B
AMKR
Amkor Technology, Inc.
Advanced packaging and test partner for high-performance logic, SiP, and heterogeneous AI hardware.
Market cap
$19.4B
0992.HK
Lenovo Group Limited
Integrates AI servers, workstations, storage, and infrastructure solutions through its infrastructure business.
Market cap
$19.0B
8046.TW
Nan Ya Printed Circuit Board Corporation
ABF substrate and high-density PCB capacity for advanced packages and AI infrastructure hardware.
Market cap
$18.0B
SMCI
Super Micro Computer, Inc.
Integrates GPU servers, AI racks, liquid-cooled systems, storage, and cluster-scale infrastructure.
Market cap
$17.4B
000977.SZ
IEIT SYSTEMS Co., Ltd.
Supplies AI servers, storage, intelligent networking, and integrated computing infrastructure.
Market cap
$16.1B
TTMI
TTM Technologies, Inc.
High-reliability PCB supplier for data center, networking, aerospace, and compute infrastructure hardware.
Market cap
$15.5B
3231.TW
Wistron Corporation
AI server and infrastructure ODM participating in cloud and enterprise hardware manufacturing.
Market cap
$14.3B
2357.TW
ASUSTeK Computer Inc.
Integrates AI servers, GPU workstations, motherboards, and edge AI systems.
Market cap
$13.8B
000938.SZ
Unisplendour Corporation Limited
Public exposure to H3C switching, routing, and data center networking platforms in China.
Market cap
$13.1B
IESC
IES Holdings, Inc.
Electrical contracting and infrastructure services exposure for AI data centers.
Market cap
$12.0B
4958.TW
Zhen Ding Technology Holding Limited
PCB manufacturing group with exposure to high-speed compute, communications, and AI infrastructure boards.
Market cap
$11.8B
600584.SS
JCET Group Co., Ltd.
China OSAT scale provider for advanced packaging and test of high-performance semiconductors.
Market cap
$11.8B
2449.TW
King Yuan Electronics Co., Ltd.
Test services capacity for logic, memory, and mixed-signal chips used in AI hardware supply chains.
Market cap
$11.1B
002156.SZ
Tongfu Microelectronics Co., Ltd.
OSAT partner for CPUs, GPUs, and high-performance packaging and test programs.
Market cap
$10.8B
SANM
Sanmina Corporation
EMS and systems integration partner for complex communications, compute, and industrial hardware.
Market cap
$10.5B
603228.SS
Shenzhen Kinwong Electronic Co., Ltd.
PCB supplier for communications, compute, automotive, and infrastructure hardware with AI data center exposure.
Market cap
$9.8B
2395.TW
Advantech Co., Ltd.
Integrates edge AI, industrial AI, embedded GPU, and applied computing systems.
Market cap
$9.7B
3189.TW
Kinsus Interconnect Technology Corp.
Package substrate and PCB supplier for processors, networking chips, and high-performance electronics.
Market cap
$8.8B
2313.TW
Compeq Manufacturing Co., Ltd.
High-density board capacity for servers, networking systems, and compute infrastructure.
Market cap
$8.1B
3044.TW
Tripod Technology Corporation
PCB capacity for memory, servers, networking, and other high-performance electronics platforms.
Market cap
$8.0B
4938.TW
Pegatron Corporation
ODM and electronics manufacturing capacity for servers, networking hardware, and edge AI systems.
Market cap
$7.2B
PLXS
Plexus Corp.
EMS partner for complex data center, communications, industrial, and compute hardware programs.
Market cap
$6.8B
2376.TW
Giga-Byte Technology Co., Ltd.
Integrates GPU servers, AI workstations, motherboards, and rack systems.
Market cap
$5.9B
002185.SZ
Tianshui Huatian Technology Co., Ltd.
China OSAT capacity for assembly and test across analog, mixed-signal, and semiconductor devices.
Market cap
$5.9B
2356.TW
Inventec Corporation
AI server and compute infrastructure manufacturing partner for cloud and enterprise customers.
Market cap
$5.5B
MYRG
MYR Group Inc.
Power delivery and electrical contracting exposure tied to grid and data center buildouts.
Market cap
$5.3B
6967.T
Shinko Electric Industries Co., Ltd.
Package substrate and advanced semiconductor package capacity for high-performance compute devices.
Market cap
$5.0B
6239.TW
Powertech Technology Inc.
Packaging and test partner for memory and semiconductor devices used in AI hardware supply chains.
Market cap
$4.9B
6787.T
Meiko Electronics Co., Ltd.
PCB capacity adjacent to high-speed communications, server, and infrastructure electronics.
Market cap
$4.7B
ATS.VI
AT & S Austria Technologie & Systemtechnik AG
Advanced IC substrate and high-end PCB capacity for processors, modules, and data center hardware.
Market cap
$4.4B
2324.TW
Compal Electronics, Inc.
Server and electronics manufacturing capacity adjacent to AI infrastructure and edge systems.
Market cap
$4.2B
353200.KS
Daeduck Electronics Co., Ltd.
Package substrate and PCB supplier for high-performance semiconductors and compute platforms.
Market cap
$3.9B
V03.SI
Venture Corporation Limited
EMS and product integration partner for complex electronics and data center-adjacent hardware.
Market cap
$3.7B
3706.TW
MiTAC Holdings Corporation
Public parent of server and systems businesses including Tyan-branded AI and HPC platforms.
Market cap
$3.5B
6147.TWO
Chipbond Technology Corporation
OSAT process capacity adjacent to advanced packaging and high-density semiconductor assembly.
Market cap
$3.4B
3264.TWO
Ardentec Corporation
Independent test services capacity for advanced logic, memory, and semiconductor supply chains.
Market cap
$3.2B
6257.TW
Sigurd Microelectronics Corporation
Packaging and test capacity for logic and mixed-signal devices in semiconductor hardware supply chains.
Market cap
$2.8B
2377.TW
Micro-Star International Co., Ltd.
Integrates AI servers, GPU workstations, accelerator platforms, and edge AI systems.
Market cap
$2.6B
BHE
Benchmark Electronics, Inc.
EMS partner for complex computing, communications, industrial, and high-performance electronics systems.
Market cap
$2.5B
222800.KQ
SIMMTECH Co., Ltd.
Memory module PCB and package substrate supplier for semiconductor and AI hardware supply chains.
Market cap
$2.1B
067310.KQ
Hana Micron, Inc.
OSAT capacity for memory and logic packages used in high-performance electronics supply chains.
Market cap
$1.8B
PENG
Penguin Solutions, Inc.
Designs and integrates AI, HPC, and accelerated computing clusters and supporting infrastructure.
Market cap
$1.6B
2441.TW
Greatek Electronics Inc.
OSAT capacity for semiconductor packaging and test across logic and mixed-signal devices.
Market cap
$1.6B
007810.KS
Korea Circuit Co., Ltd.
Package substrates and PCBs for semiconductor packages, compute hardware, and high-density electronics.
Market cap
$1.6B
8150.TW
ChipMOS Technologies Inc.
OSAT capacity for memory, driver, and semiconductor devices adjacent to advanced electronics supply chains.
Market cap
$1.6B
036540.KQ
SFA Semicon Co., Ltd.
Packaging capacity for memory and logic semiconductors used in advanced electronics supply chains.
Market cap
$1.1B