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SemicapIndustry / 6146.T
Disco Corporation
Dicing, grinding, polishing, and wafer-thinning equipment supplier.
Price
$71700.00
Change
-300.00 (-0.42%)
Market cap
$7.78T
52w range
$26970–$81000
Exchange
JPX
Country
JP
AI relevance
Enables thin wafers, chiplets, HBM, and advanced package preparation.
Financials
Revenue, margins, cash flow
FY 2026 · reported 2026-03-31
- Revenue
- $436.89B
- Gross margin
- 69.9%
- Op margin (TTM)
- 42.2%
- Net margin (TTM)
- 31.0%
- R&D
- $0
- Free cash flow
- $97.83B
- Capex
- $35.80B
- EV / EBITDA
- 38.2x
Transcripts
Earnings call library
1 on file
Ownership
13F holders and ETF exposure
No 13F data on file.
Events
Calendar, news, filings
Next earnings
2026-07-23EPS est $303.74