Materials / ConsumablesIndustry / 300054.SZ
Hubei Dinglong CO.,Ltd. logo

Hubei Dinglong CO.,Ltd.

CMP polishing pad, slurry, and semiconductor materials supplier.

Price

$57.00

Change

+1.05 (+1.88%)

Market cap

$53.5B

52w range

$27–$58

Exchange

SHZ

Country

CN

AI relevance

CMP consumables and polishing materials support advanced wafer production.

Financials

Revenue, margins, cash flow

FY 2025 · reported 2025-12-31

Revenue
$3.64B
Gross margin
47.2%
Op margin (TTM)
24.3%
Net margin (TTM)
19.7%
R&D
$449.3M
Free cash flow
$392.4M
Capex
$775.4M
EV / EBITDA
51.0x

Transcripts

Earnings call library

No transcripts on file.

Ownership

13F holders and ETF exposure

No 13F data on file.

Events

Calendar, news, filings

Next earnings

2026-04-28